Semiconductor processing apparatus and methods for monitoring and controlling a semiconductor processing apparatus
US12234552B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Sep 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67754
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor processing apparatus is disclosed. The apparatus may include a multiple chamber module comprising at least a first reaction chamber and a second reaction chamber, and a first substrate support structure disposed within the first reaction chamber and a second substrate support structure disposed within the second reaction chamber. The apparatus may also include a wafer handling chamber comprising a transfer robot configured for transferring two or more substrates along a first transfer path between the wafer handling chamber and the first substrate support structure and a second transfer path between the wafer handling chamber and the second substrate support structure. The apparatus may also include at least a first pyrometer and a second pyrometer, wherein a first optical path of the first pyrometer intersects the first transfer path and a second optical path of the second pyrometer intersect the second transfer path. Methods of monitoring and controlling a semiconductor processing apparatus are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.