Method for forming structures including transition metal layers
US12241158B2 · kind B2 · utility
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2,219References
19Claims
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Key dates
| Filing date | Jul 15, 2021 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jul 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for forming transition metal layers on a surface of a substrate are disclosed. Exemplary methods include forming a transition layer prior to forming the transition metal layer. The transition layer can be used to facilitate subsequent deposition of the transition metal layer on high aspect ratio features, while mitigating bending of the features during deposition of the transition metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.