Multicomponent photonically intra-die bridged assembly
US12242122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2024 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4245
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package includes a first die with a compute element and first region, a second die with a compute element and second region, and a bridging element connecting the first and second dies. The bridging element includes interconnect regions for electrical coupling, a first photonic path from the first interconnect region to the second, and a second photonic path in the reverse direction. A photonic transceiver is integrated into the bridging element, with one portion sending and receiving optical signals via the photonic paths, and the other portion located in an AMS block in the first die or second die near the memory and compute elements. The transceiver portions are connected by a short electrical interconnect (less than 2 mm).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.