Flange and apparatus for processing substrates
US12243757B2 · kind B2 · utility
0Cited by
2,210References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2021 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Sep 4, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2009/0013
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.