Circuit substrate structure and manufacturing method thereof
US12243838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2022 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jan 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/17181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit substrate structure includes a circuit substrate, at least two chips, and a bridge element. The circuit substrate has a first surface and a second surface opposite to each other. The chips are arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit substrate. The chips have active surfaces, back surfaces opposite to the active surfaces, and side surfaces connecting the active surfaces and the back surfaces. The chips include side circuits. The side circuits are arranged on the side surfaces and have first ends and second ends, the first ends extend to the active surfaces along the side surfaces, and the second ends extend to the back surfaces along the side surfaces. The bridge element is arranged on the back surfaces of the chips and electrically connected to the active surfaces of the chips through the side circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.