Clustered rigid wafer test probe

US12248003B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David M. Audette · Webster, US
• Grant Wagner · Jericho, US
• Peter W. Neff · Stowe, US
• Jacob Louis Moore · Checkerberry Village, US
• Melissa Keefe · Whitehall Corners, US

Key dates

• Filing date: Dec 6, 2022
• Grant date: Mar 11, 2025
• Expiry date: Jun 12, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/07342
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated against one contact of the IC device. In this manner, the IC device test probe is seated against multiple contacts and may therefore apply test signal(s) to these contacts serially, simultaneously, or the like. The IC device test probe allows the seating to small pitch IC devices and associated testing thereof. This allows for electrical characterization of the IC device by the same test signal(s) through the IC device test probe and ultimately through multiple contacts. The forces associated with seating the IC device test probe against the IC device contacts is effectively spread across multiple contacts.