Thermal contacts at periphery of integrated circuit packages

US12249553B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sonja Koller · Regensburg, DE
• Vishnu Prasad · Chennai, IN
• Georg Seidemann · Landshut, DE

Key dates

• Filing date: Jun 22, 2018
• Grant date: Mar 11, 2025
• Expiry date: Aug 17, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a periphery of the IC package. In some embodiments, thermal contacts are such that at least a portion of a heat exchanger is to be attached on the side of the IC package. In some embodiments, thermal contacts may be provided within a recessed portion at the periphery of the IC package. Providing a thermal contact at a periphery of an IC package may enable improved cooling options, especially for systems where there is no or limited space for providing conventional heat exchangers on the top of the package.