Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
US12256490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2018 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Apr 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.