Bonding system and bonding method
US12261147B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 14, 2023 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Oct 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article; and a device for transporting a second article that transports, to the bond device, at least one of the plurality of second articles supplied from the device for supplying a second article, and the device for transporting a second article comprises a holder for holding a second article that holds the uneven portion of the at least one second article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.