Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems
US12262478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Mar 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0776
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The electronic circuit board having electronic components thereon. A protective material coated on an exposed material of the electronic circuit board and the electronic components. The protective material being chemically inert with the exposed material. The protective material being chemically inert with an immersion bath cooling liquid that the electronic circuit board and the electronic components are to be immersed within. A thermal cooling structure of one of the electronic components that is designed to transfer heat into the immersion bath cooling liquid is not coated with the protective material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.