Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
US12264224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Mar 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.