Friction stir welding in semiconductor manufacturing applications
US12272591B2 · kind B2 · utility
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3References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2020 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Jun 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/021
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an example, a showerhead pedestal assembly for a substrate processing chamber is provided. The showerhead pedestal assembly includes a faceplate. A platen is disposed within the faceplate and includes a heater element extending through at least one groove in the faceplate. The at least one groove is profiled to accept at least one portion of the heater element. A periphery of the platen is joined to an interior surface of the faceplate by a friction stir welded joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.