Support unit, substrate treating apparatus including the same, and substrate treating method
US12278121B2 · kind B2 · utility
0Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2020 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | May 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.