Patent · US Active

Chip package and method of forming a chip package

US12278171B2 · kind B2 · utility

0Cited by

11References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Chan Lam Cha · Melaka City, MY
Wern Ken Daryl Wee · Melaka City, MY
Hoe Jian Chong · Melaka City, MY
Chin Kee Leow · Melaka City, MY

Key dates

Filing date	Dec 20, 2022
Grant date	Apr 15, 2025
Priority date	—
Expiry date	Dec 20, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.