Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
US12279395B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Apr 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.