Electronic package including electronic structure and electronic body and manufacturing method thereof
US12283560B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2024 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Jan 16, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.