Metal complexes containing cyclopentadienyl ligands
US12286449B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | Mar 11, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Mar 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Metal complexes including cyclopentadienyl ligands and methods of using such metal complexes to prepare metal-containing films are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.