Methods and apparatus for processing a substrate
US12288704B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Nov 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a transfer robot configured to position a substrate on a substrate support disposed within an interior of a processing chamber configured to process the substrate and a sensor disposed on the transfer robot, operably connected to a controller of the processing chamber, and configured with an angle of view to provide in-situ continuous closed loop feedback relating to spatial information of the interior of the processing chamber to the controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.