System and method for removing impurities during chemical mechanical planarization
US12293917B2 · kind B2 · utility
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5References
21Claims
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Key dates
| Filing date | Jun 23, 2021 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Jun 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. An impurity removal system removes debris and impurities from the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.