Te-Chien Hou
9Patents
1h-index
18Co-inventors
40Inventor score
Filing activity: Nov 16, 2015 → Apr 10, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10160091B2 | CMP polishing head design for improving removal rate uniformity | Performing Operations; Transporting | 2 | Active |
| US11069533B2 | CMP system and method of use | Electricity | 1 | Active |
| US11389928B2 | Method for conditioning polishing pad | Performing Operations; Transporting | 1 | Active |
| US11529712B2 | CMP polishing head design for improving removal rate uniformity | Performing Operations; Transporting | 1 | Active |
| US12424449B2 | CMP system and method of use | Electricity | 0 | Active |
| US11865666B2 | CMP polishing head design for improving removal rate uniformity | Performing Operations; Transporting | 0 | Active |
| US11984323B2 | CMP system and method of use | Electricity | 0 | Active |
| US12427618B2 | Chemical-mechanical planarization pad and methods of use | Electricity | 0 | Active |
| US12293917B2 | System and method for removing impurities during chemical mechanical planarization | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.