Boiling enhancement structures for immersion cooled electronic systems
US12293956B2 · kind B2 · utility
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5References
24Claims
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Key dates
| Filing date | Jun 23, 2021 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Jun 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.