Apparatus and method for CMP temperature control

US12296427B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Haosheng Wu · San Jose, US
• Shou-Sung Chang · Mountain View, US
• Chih Chung Chou · San Jose, US
• Jianshe Tang · San Jose, US
• Hui Chen · Burlingame, US
• Hari Soundararajan · Sunnyvale, US
• Brian J. Brown · Eastleigh, GB

Key dates

• Filing date: Aug 10, 2020
• Grant date: May 13, 2025
• Expiry date: Aug 20, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67248
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.