Compounds and methods for selectively forming metal-containing films

US12297537B2 · kind B2 · utility

Assignee

• Merck Patent GmbH · DE

Inventors

• Charith Nanayakkara · Haverhill, US
• Joby Eldo · Andover, US
• Jacob Woodruff · Scottsdale, US
• Charles Dezelah · Helsinki, FI
• Shawn Sungeun HONG · Westford, US
• Ravindra KANJOLIA · North Andover, US
• Daniel Moser · Manitowoc, US
• Mark C. Potyen · Somerville, US

Key dates

• Filing date: Nov 3, 2020
• Grant date: May 13, 2025
• Expiry date: Aug 6, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02304
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Compounds for selectively forming metal-containing films are provided. Methods of forming metal-containing films are also provided. The methods include forming a blocking layer, for example, on a first substrate surface, by a first deposition process and forming the metal-containing film, for example, on a second substrate surface, by a second deposition process.