Optically bridged multicomponent package with extended temperature range
US12298608B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2024 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Jun 13, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4245
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.