Semiconductor substrate support power transmission components
US12300474B2 · kind B2 · utility
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1References
16Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Dec 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The assemblies may include a power transmission rod coupled with the electrode. The power transmission rod may include a material characterized by a coefficient of thermal expansion of less than or about 10×10−6/° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.