Semiconductor packages and methods for manufacturing thereof

US12300559B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Si Hao Vincent Yeo · Melaka City, MY
• Chan Lam Cha · Melaka City, MY
• Ying Dieh Cheong · Melaka City, MY
• Chau Fatt Chiang · Melaka City, MY
• Cher Hau Danny Koh · Melaka City, MY
• Wern Ken Daryl Wee · Melaka City, MY
• Swee Kat Lee · Melaka City, MY
• Desmond Jenn Yong Loo · Melaka City, MY
• Fortunato Lopez · Unterhaching, DE
• Norliza Morban · Melaka City, MY
• Khay Chwan Saw · Melaka City, MY
• Sock Chien Tey · Melaka City, MY
• Mei Yong Wang · Melaka City, MY

Key dates

• Filing date: Dec 16, 2021
• Grant date: May 13, 2025
• Expiry date: Jul 19, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.