Fully molded structure with multi-height components comprising backside conductive material and method for making the same
US12300561B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Jun 14, 2024 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Jun 14, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.