Grinding apparatus and use method of grinding apparatus
US12304027B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Jun 9, 2020 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.