Tomotaka Tabuchi
10Patents
2h-index
17Co-inventors
47Inventor score
Filing activity: Nov 15, 2002 → Aug 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6852608B2 | Production method for semiconductor chip | Emerging Cross-Sectional Technologies | 10 | Expired |
| US9330976B2 | Wafer processing method | Electricity | 3 | Active |
| US11056346B2 | Wafer processing method | Electricity | 1 | Active |
| US10115636B2 | Processing method for workpiece | Electricity | 1 | Active |
| US9123797B2 | Resin powder wafer processing utilizing a frame with a plurality of partitions | Electricity | 1 | Active |
| US12304027B2 | Grinding apparatus and use method of grinding apparatus | Performing Operations; Transporting | 0 | Active |
| US10354919B2 | Wafer dividing method | Electricity | 0 | Active |
| US9112019B2 | Wafer processing utilizing a frame with a plurality of partitions | Electricity | 0 | Active |
| US10692721B2 | Wafer processing method for reforming protective film | Electricity | 0 | Active |
| US10468303B2 | Device chip manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.