Substrate treating method and substrate treating apparatus
US12308219B2 · kind B2 · utility
0Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Dec 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate treating method includes a temperature stabilizing step for stabilizing a temperature of the substrate to a process temperature in a treating space for treating a substrate, a pressure stabilizing step for stabilizing a pressure of a plasma space for generating a plasma and a pressure of the treating space to a process, the plasma space fluid communicating with the treating space, and a treating step for generating the plasma at the plasma space and treating the substrate using the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.