Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
US12309966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Sep 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.