Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

US12311455B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Axel Beyer · Munich, DE
• Patrick Berger · Steffisburg, CH
• Wolfgang Dietz · New Hope, US
• Carl Frintert · Mühldorf a. Inn, DE
• Matthias Guenther · Bremen, DE

Key dates

• Filing date: May 27, 2021
• Grant date: May 27, 2025
• Expiry date: Jul 28, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B28D5/045
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.