Pressure signals during motor torque monitoring to provide spatial resolution
US12311494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Mar 26, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first modulation function to a first region of the substrate, applying a second pressure modulated by a second modulation function that is orthogonal to the first modulation function to a second region of the substrate, during polishing of the substrate monitoring the substrate with an in-situ friction monitoring system to generate a sequence of measured values, and determining a relative contribution to the sequence of measured value from the first region and second region based on distinguishing the first frequency from the second frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.