Technologies for processor loading mechanisms
US12315780B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2021 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Sep 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.