Apparatus for temperature measurement and method of processing substrate
US12317419B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Aug 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.