Frame for coupling of a thermal management device to a printed circuit board
US12324101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2023 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.