Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package
US12324105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2021 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Jul 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/068
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.