Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

US12325081B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Axel Beyer · Munich, DE
• Carl Frintert · Mühldorf a. Inn, DE
• Peter Wiesner · Simbach, DE

Key dates

• Filing date: Jun 7, 2021
• Grant date: Jun 10, 2025
• Expiry date: Aug 14, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B28D5/045
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.