Complex waveform for electrolytic plating
US12325927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1492
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate: and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating, DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.