Integrated semiconductor part cleaning system

US12327738B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jenn C. Chow · Campbell, US
• David W. Groechel · Los Altos Hills, US
• Tuochuan Huang · Saratoga, US
• Dorothea Buechel-Rimmel · San Jose, US
• Han-Wei Wang · Campbell, US
• Li Wu · Fremont, US
• Gang Peng · Beijing, CN

Key dates

• Filing date: May 1, 2019
• Grant date: Jun 10, 2025
• Expiry date: Jan 24, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68728
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein relate to chamber component cleaning systems and methods for cleaning a chamber component. The chamber component cleaning system includes a spray station, at least a first cleaning station, a dry station, a component transfer mechanism, and one or more enclosures that enclose the spray station, at least the first cleaning station, the dry station, and the component transfer mechanism. The spray station has a holder to position a chamber component in a path of a flow of a cleaning spray and a movable nozzle to provide the flow of the cleaning spray at a first pressure in a path of portions of the chamber component. The first cleaning station has a push mechanism to force a cleaning fluid through features and/or holes of the chamber component and at least one movable transducer to provide ultrasonic energy to the portions of the chamber component.