Cooled substrate support assembly for radio frequency environments
US12334315B2 · kind B2 · utility
0Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2020 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Mar 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.