Detachable structure used for transferring or handling layers, and process for transferring a layer using the detachable structure
US12334347B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Oct 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A detachable structure comprises at least two interfaces including an assembly interface and a favored-detachment interface, a receiver substrate, and a donor substrate comprising a working layer that is to be transferred, arranged on an initial substrate. The favored-detachment interface is situated between the working layer and the initial substrate, and the assembly interface is situated between the working layer and the receiver substrate. The assembly interface has an assembly-interruption zone comprising at least one cavity present in the receiver substrate or in the working layer, and the assembly-interruption zone is located in a peripheral region of the detachable structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.