Electronic package and manufacturing method thereof
US12334452B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Feb 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.