Package with pad having open notch
US12334458B2 · kind B2 · utility
0Cited by
13References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Mar 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.