Adrian Lis
7Patents
0h-index
9Co-inventors
27Inventor score
Filing activity: Jun 29, 2021 → Aug 5, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12062589B2 | Semiconductor packages including recesses to contain solder | Electricity | 0 | Active |
| US12183667B2 | Semiconductor package with power electronics carrier having trench spacing adapted for delamination | Electricity | 0 | Active |
| US12113000B2 | Lead adapters for semiconductor package | Electricity | 0 | Active |
| US12300643B2 | Solder stop feature for electronic devices | Electricity | 0 | Active |
| US12224222B2 | Semiconductor package having a thermally and electrically conductive spacer | Electricity | 0 | Active |
| US12334458B2 | Package with pad having open notch | Electricity | 0 | Active |
| US12374661B2 | Power module having vertically aligned first and second substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.