Shutter disk for physical vapor deposition (PVD) chamber

US12338527B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Zhiyong Wang · Sunnyvale, US
• Halbert Chong · San Jose, US
• Irena H. Wysok · San Jose, US
• Jianxin Lei · Fremont, US
• Rongjun Wang · Dublin, US
• Lei Zhou · Tianjin, CN
• Kirankumar Neelasandra SAVANDAIAH · Bengaluru, IN
• Sundarapandian Ramalinga Vijayalakshmi REDDY · Kanchinakote, IN

Key dates

• Filing date: Aug 31, 2022
• Grant date: Jun 24, 2025
• Expiry date: Nov 18, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/335
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a non-sputtering shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.