Halbert Chong
8Patents
1h-index
30Co-inventors
40Inventor score
Filing activity: May 15, 2019 → Sep 9, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11289312B2 | Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability | Electricity | 2 | Active |
| US11473189B2 | Method for particle removal from wafers through plasma modification in pulsed PVD | Electricity | 1 | Active |
| US11251024B2 | Coating for chamber particle reduction | Electricity | 0 | Active |
| US11661652B2 | Wet cleaning inside of gasline of semiconductor process equipment | Electricity | 0 | Active |
| US11932934B2 | Method for particle removal from wafers through plasma modification in pulsed PVD | Electricity | 0 | Active |
| US11249390B2 | Extreme ultraviolet mask absorber materials | Physics | 0 | Active |
| US12338527B2 | Shutter disk for physical vapor deposition (PVD) chamber | Electricity | 0 | Active |
| US11898236B2 | Methods and apparatus for processing a substrate | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.