Spatially tunable deposition to compensate within wafer differential bow
US12338531B2 · kind B2 · utility
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85References
20Claims
0Family size
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Key dates
| Filing date | Jan 30, 2024 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma processing chamber for depositing a film on an underside surface of a wafer, includes a showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.