Electrostatic edge ring mounting system for substrate processing
US12340989B2 · kind B2 · utility
0Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Sep 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68721
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during processing. An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support during plasma processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.