Method and system for forming material within a gap
US12341003B2 · kind B2 · utility
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20Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 27, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Oct 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28556
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for forming material within a gap on a surface of a substrate are disclosed. An exemplary method includes depositing a soluble layer on a surface of the substrate and exposing the soluble layer to a solvent to thereby form solvated material within the gap. Exemplary methods can further include drying the solvated material and/or converting the solvated or dried material to another material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.